Reference Paper

“Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode”(716KB)

	"Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder"(1,549KB)
	"Creep Behavior and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy"(1,652KB)
	"The Lead-Free Solder of Addition Micro-Elements in Industrial Products"(written in Japanese)(1,663KB)
	"Effect of Microelements Addition on the Interfacial Reaction between Sn-Ag-Cu Solders and the Cu Subsrate"(658KB)
	"Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes"(1,108KB)
	"Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish"(1,225KB)

Elements/Feature

Our developed solder have a feature such as excellent solderbility and thermal stability and decreasing of the dross (oxidation refuse) by suppressing oxidation as a result of adding small amount of Ni (Nickel) and Ge (Germanium) in to the Sn-Ag-Cu (Tin-Silver-Copper) alloy and the Sn-Bi (Tin-Bismuth) alloy.