| LEAD-FREE
SOLDER BALLS |
This product is also featured in the sections "IT Components & Materials"
and "Computers & Semiconductor IC Products."
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| Overview |
Using
new manufacturing techniques, Hitachi Metals has developed inexpensive,
high-quality LEAD-FREE SOLDER BALLS for ball-grid-array (BGA) and
chip-scale-package (CSP) applications.
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| Proprietary
Features |
- High-speed droplet cutting enables accelerated production.
- As no oil is needed in the manufacturing process, surface oxidation
can be controlled.
- Permits only minor variations in composition
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| Solder
Ball Manufacturing Methods |
Conventional Method:
Oil-based Granulation |
Uniform Droplet Spray Method |
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Solder materials must undergo processing to make fine-wire
and foil solders. |
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It requires a time-consuming oil-removal process and
results in inferior surface properties. |
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Production speed is slow. |
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Facilitates use of solder materials that are difficult
to form into fine-wire and foil solders. |
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Oil-free process; limits surface oxidation |
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Virtually no variation in surface composition |
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| Range
of Production Sizes |
Applications |
Diameter: 60~760 m |
This method enables the
production of balls from all basic lead-free solder materials, including
Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Bi, Sn-Cu and Sn-Zn.
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| Prior
to Adoption Warning |
| • Cautionary Items |
| - Solder balls cannot be handled with bare hands. |
| - Use immediately after opening |
| • Usage Restrictions |
| - Solder balls may become deformed or exhibit
defects when subjected to extreme stress or vibrations. |
| - Blackening may occur if solder materials are
kept in the ball mounter for extended periods. |
| • Application Environment |
| - Small solder balls should not be used in extremely
humid or dry conditions. |
| - Balls should be used only in a clean room. |
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| Inquiries |
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