Legislation and Regulation


European Union(RoHS/WEEE)
China(MII)
Japan(JEITA)

Supplier Links

ADI
ANADIGICS
Atmel
CapXX
E-Switch
Fairchild
Freescale
Fuji
Hitachi Metals
Holtek
Hynix
Intel
ISSI
LITTELFUSE
Molex
Nic
Omnivision
ON
Philips
ROHM
Solomon Systech
Superworld
TI
Toshiba
Vishay
Winbond

Pb Free
Vendor Web Link Material Content Vendor Compliance Statement 3rd Party Testing Report
WPIG PB free Statement    


Lead Free Background.


Although lead, when inhaled or ingested, is certainly toxic, there is still a lack of evidence that lead in electronics represents an environmental or human health concern.

The primary legislation driving lead free is the European Union's Restriction of Hazardous Substance (RoHS) Directive. Unfortunately in many cases the Directive is still unclear as to what is covered and what is not due to multi-use equipment(like car radios). Furthermore the assumed limitations of scope that are included in WEEE were accidentally left out of RoHS when the regulations were separated.

World Regulation Activity:

European Union: RoHS/WEEE
United States: RCRA/TRI/OSHA
Japan: MITI
China: MII
Korea: EPR



PB Materials Declarations


Guidance from the U.K. Department of Trade and Industry as well as a compliance proposal developed by the European Trade Association EICTA emphasize the importance of materials declarations, i.e. supplier disclosure regarding the material content of supplied materials/products.

A large area of concern with the use of tin-plated or pure tin component finishes is the occurrence of tin whiskers. This condition arises when tin begins to grow tiny filaments known as whiskers. A tin whisker is a spontaneous columnar or cylindrical filament, of mono-crystalline tin emanating from the surface of a plating finish (which can branch). Tin whiskers generally have an aspect ratio (length/width) greater than 2; whiskers have been found to be over several mm in length in rare instances. The whiskers can be kinked, bent, or twisted and may be surrounded by striations/rings. These whiskers are very brittle therefore can lead to intermittent or permanent electrical shorts when broken and re-deposited upon the circuit's surface.

Highly stressed deposits of pure, electroplated, 'bright' tin are probably the most susceptible to tin whisker formation. However, immersion tin deposits, while much thinner and much less prone to be stressed, have still shown evidence of tin whisker formation. Absolutes do not apply to this phenomenon


Vendor Web Link

ADI
ANADIGICS
Atmel
CapXX
E-Switch
Fairchild
Freescale
Fuji
Hitachi Metals
Holtek
Hynix
Intel
ISSI
LITTELFUSE
Molex
Nic
Omnivision
ON
Philips
ROHM
Solomon Systech
Superworld
TI
Toshiba
Vishay
Winbond
 

Material Content


ADI
Freescale
Intel
ON
TI
Vishay
PPAKSO-8 Dual leadfree | PPAKSO-8 Single leadfree | SC70 leadfree | SC75A leadfree
SC89 leadfree | SO-8 dual leadfree | SO-8-BWL leadfree | SO-8-single leadfree
SOIC16 leadfree | SOT23 31d leadfree | TO220 leadfree | SOD80 leadfree
QuadroMELF-leadfree | SOD64 leadfree
 

Vendor Compliance Statement


AME
Amphenol
Anadigics
Atheros
CapXX
E-Switch
Fairchild
Freescale
Intel
ISSI
ON
Philips
Pretec
RoHm
TI
Vishay
 

WPIG PB free Statement
World Peace Industrial Co., Ltd and its affiliates (collectively referred to as the “WPI Group”) would like to thank our customers (“You”) for your continued support. The WPI Group is deeply honored that you have chosen us as your fulfillment partner and appreciates the working relationship that has been fostered successfully over the years. As part of its environmental initiative, the WPI Group is working with its principals to provide more information on product compliance with the European Union Restriction of Hazardous Substances Directive (“RoHS”).

1. As a distributor, the WPI Group does not participate in the manufacturing process and therefore has no actual knowledge of the specific substances contained in and/or used in the manufacturing process of any product (“Product”) supplied to You. The WPI Group may only rely on the warranties and representations made by the relevant manufacturer (“Manufacturer”). In order to assist you in navigating the information available, the WPI Group has provided a summary of hyperlinks which will bring you to the official website of the Manufacturer, as well as the Vendor Statements and/or the independent third party analysis report, which may be downloaded from this site. The Manufacturer websites, along with the Vendor Statements are updated and maintained by the applicable Manufacturer. The WPI Group makes no representation nor warranty as to the form nor content of such websites or Vendor Statements maintained or issued by the Manufacturer or independent third party analysis report.

2. Notwithstanding the foregoing, in the event of any discrepancy (“Discrepancy”) between the Product supplied and any content specifications (“Specification”) as described in the official website, Vendor Statement or independent third party analysis report posted hereon , subject to and insofar as the same is represented and warranted by the Manufacturer, the WPI Group shall liaise with the Manufacturer for any remedial action in order to hold You harmless from any loss, or damage (excluding consequential or indirect loss or damage, lost profits, economic loss and/or punitive damages) caused by such Discrepancy. You are aware and acknowledge that the obligation described herein is the sole responsibility and/or liability undertaken by the WPI Group in respect of any Discrepancy and shall surpass any and all liability, past, now and future, agreed upon by the parties.

3. If the hyperlink for any Product is not shown on this website, please refer to the Specification provided by the Manufacturer to the WPI Group. In the event of any discrepancy between the Specification, the information on the website of the relevant Manufacturer, the Vendor Statement and/or the third party analysis report posted on this website, the Specification shall prevail

4. WPI shall not be liable to You nor to any third party should You continue to purchase Product which contains substances in contravention of RoHS.


 




    3rd Party Testing Report List  

Brand Testing Report
AME AME_SGS D-PAK CE200645562A_060504 AME_SGS SOP,PSOP,TSSOP,MSP CE200658656_060602 AME_SGS SOT-89 CE200658655_060602
AME_SGS SOT,TSOP CE200658658_060602 AME_SGS SOT-223 CE200658654_060602 AME_SGS TO92,SIP3~4 CE200658660_060602
AME_SGS TO220,262,263 CE200658659_060602    
Capxx Capxx_Leader Plastic M240614_040524    
Elan Elan_SGS ePH1100SH_CE2005-62126B_050615 Elan_Greenpackage IR Refloe Profile Elan_Normal IR Refloe profile
Fairchild Fairchid_SGS_2004_C3003A_S Fairchild_SGS_2004_14370_S Fairchild_SGS_2004_80471_S
Fairchild_SGS_2004_90194A_ Fairchild_SGS_2004_90196_T Fairchild_SGS_2004_90698_T
Fairchild_SGS_2004_A0362A_ Fairchild_SGS_2004_B4754_T Fairchild_SGS_2004_C0873A_
Fairchild_SGS_2004_C0874A_ Fairchild_SGS_2004_C0875A_ Fairchild_SGS_2004_C1232A_
Fuji_SGS IC SMD CE200612761_060118 Fairchild_SGS_2004_C1648_T Fairchild_SGS_2004_C2149A_
Fuji Fuji_ SGS DIODE TO3P CE200612751_060117 Fuji_M-Power1 MS5F5402_030317 Fuji_SGS DIODE LEAD CE200612753_060117
Fuji_SGS DIODE SMD CE200612754_060117 Fuji_SGS DIODE TO-220 CE200612749_060117 Fuji_SGS DIODE TO-220F CE200612750_060117
Fuji_SGS DIODE TO-247 CE200612752_060117 Fuji_Silicon Diode MS5D1756_030407 Fuji_SGS IC DIP CE200612762_060117
Fuji_SGS IC SMD CE200612761_060118 Fuji_Silicon Diode MS5D1756_030407 Fuji_SGS IC DIP CE200612762_060117
ON ON_SGS_2004_B3719A_SOT-23_ ON_SGS_2004_B4696A_Dpak___ ON_SGS_2004_C2999_SOT223_R
ON_SGS_2004_C3000_SOIC-8_R ON_SGS_2005_10186_SMA_RoHS  
OV OV_SGS_2004_B2136B__ShellO OV_SGS_2005_42867_CLCC_(OV OV_SGS_2005_42867_CLCC_(OV
OV_SGS_2004_B2136A_Shell_O    
NXP Philips_SGS_2004_53292_SOT Philips_SGS_2004_83087_SOT Philips_SGS_2004_83088_SOD
Philips_SGS_2004_90276_SOT Philips_SGS_2004_91401_TZA Philips_SGS_2004_91402_SA5
Philips_SGS_2004_A3487_PNX Philips_SGS_2005_11686_SOT Philips_SGS_2005_23620_(_P
Philips_SGS_2005_45389_SO8 Philips_SGS_DPAK-TO220AB_2 Philips_SGS_LCD_driver_RoH
Philips_SGS_SOT-17item_200 Philips_SGS_2004_C5653A_SO  
Pretec Pretec_Integrated_Cheetah Pro CF 256MB RoHS A9400419_050805 Pretec_Integrated_Silver CF RoHS_559010 A9400385_050805 Pretec_Integrated_Silver CF RoHS_559010 A9400385_050805
TI TI_SGS_2005_42893A_SC-70_R TI_SGS_2005_42894_VSSOP8_R TI_SGS_2005_43838_SOT23_Ro
Vishay Vishay_SGS_2004_B4695A_SO- Vishay_SGS_2004_B4742A_SOT Vishay_SGS_2005_34535_SC70
Vishay_SGS_2005_34536_1206 Vishay_SGS_Power_Pak_2005_  
Youngfast Youngfast_SGS flexible printed circuit_CE2005-32348_050317 Youngfast_Intertek ITO Film_THJ0008931_051107 Youngfast_Intertek ITO Glass_THJ0008932_051107
Youngfast_Intertek ink_THJ0008930_051108    



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